Expert electronic parts marketplace information details? In the past Wi-Fi technology, intercell co-channel interference (Co-Channel Interference,CCI) is another important factor affecting channel capacity. The core of CSMA/CA is to listen before you speak (listen before talk,LBT). The device monitors the wireless channel first and sends data without being occupied. In the case of multi-AP mesh networking (AP,Access Point, wireless access point), the equipment in the cell will listen to the interference signal of the cell adjacent to the same channel, causing the device to mistakenly think that the wireless channel of the cell is being occupied at this time, so stop transmitting. This kind of interference will significantly reduce the network capacity when the network is not optimized or the number of available channels is very small. As shown in the figure below, the four Wi-Fi AP are networked with three channels. However, since there are only three channels available, AP1 and AP2 have to be deployed on the same channel Channel 6, when the signal of AP2 is interference to the user equipment belonging to AP1-Overlapped Basic Service Set (OBSS, overlapping basic service units, which can be understood as overlapping cells with the same frequency). Read additional information on dmn26d0udj-7.
With the increasing degree of automation of cars and electric vehicles, the number of semiconductors required will increase sharply. Most semiconductors are traditional analog and power semiconductors. These traditional analog and power semiconductors are produced by 8-inch factories. Because it is difficult to ensure 8-inch manufacturing equipment, it is difficult to add new 8-inch semiconductor factories. In short, self-driving cars certainly need state-of-the-art semiconductors to run advanced artificial intelligence (AI), but the need for a large number of traditional analog and power semiconductors has become the Achilles’ heel of automobile production, and it is not easy to solve this problem. Although the automobile industry has ushered in an once-in-a-century period of great change in CASE (Connected, Autonomous/Automated, Shared, Electric), it is also an era suffering from the shortage of semiconductors.
In the onboard system shown in the figure above, the green rectangle represents the printed circuit board (PCB), and the small rectangles of various colors above represent various functional modules in the system, such as memory. The functions of these modules are implemented by independent silicon chips, and they are connected by metal traces on the PCB to finally form a complete system. The System-on-Chip refers to the realization of the functions of the entire system on a single silicon chip. The schematic diagram is as follows: As shown in the figure above, a system-on-a-chip (SoC) implements various functional modules such as storage, processing, logic, and interfaces in one chip, rather than requiring several different physical chips to be implemented like a system-on-board. Compared with system-on-board, SoC solutions are lower cost, enable faster and more secure data transfer between different system units, have higher overall system speed, lower power consumption, smaller physical size, and better reliability.
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